发明名称 METHOD FOR INJECTION MOLDING RESIN
摘要 PROBLEM TO BE SOLVED: To provide a method for molding a resin capable of adopting a multi- cavity mold, reducing a using resin amount with excellent flowability at a molding time, and remarkably improving productivity of a molding at a low production cost of the molding. SOLUTION: The method for molding the resin using a mold having a sprue, a runner and a cavity comprises the step of molding the resin by using the runner having a sectional area of less than 2.0 mm2 and using the resin having a melt viscosity measured under the conditions of a temperature higher by 25 deg.C than its melting point and a shearing speed of 1,000 sec-1 poise or less, of 800 poise or less.
申请公布号 JP2002018907(A) 申请公布日期 2002.01.22
申请号 JP20000354200 申请日期 2000.11.21
申请人 UENO SEIYAKU OYO KENKYUSHO:KK 发明人 UENO RYUZO;KITAYAMA MASAYA;YONETANI KIICHI
分类号 B29C45/26;B29C45/00;B29C45/27;B29C45/32;B29C45/76;B29K105/06;(IPC1-7):B29C45/26 主分类号 B29C45/26
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