发明名称 COPPER FOIL WITH RESIN FOR LASER BEAM BORING AND ITS PRODUCTION METHOD
摘要 PROBLEM TO BE SOLVED: To provide copper foil with a resin capable of laser beam boring in order to enable the adoption of a copper direct method which can use a conventional infrastructure directly and reduce costs by cutting a process and a method for producing the copper foil. SOLUTION: In the copper foil with the resin for laser beam boring, a surface layer of manganese and/or a manganese alloy is formed on the surface on the laser beam irradiation side of the copper foil.
申请公布号 JP2002019017(A) 申请公布日期 2002.01.22
申请号 JP20000210871 申请日期 2000.07.12
申请人 HITACHI METALS LTD 发明人 MINE YOJI;YANO KENTARO;SATO KOJI
分类号 H05K1/09;B32B15/08;C23C14/16;H05K3/00;(IPC1-7):B32B15/08 主分类号 H05K1/09
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