发明名称 |
COPPER FOIL WITH RESIN FOR LASER BEAM BORING AND ITS PRODUCTION METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide copper foil with a resin capable of laser beam boring in order to enable the adoption of a copper direct method which can use a conventional infrastructure directly and reduce costs by cutting a process and a method for producing the copper foil. SOLUTION: In the copper foil with the resin for laser beam boring, a surface layer of manganese and/or a manganese alloy is formed on the surface on the laser beam irradiation side of the copper foil.
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申请公布号 |
JP2002019017(A) |
申请公布日期 |
2002.01.22 |
申请号 |
JP20000210871 |
申请日期 |
2000.07.12 |
申请人 |
HITACHI METALS LTD |
发明人 |
MINE YOJI;YANO KENTARO;SATO KOJI |
分类号 |
H05K1/09;B32B15/08;C23C14/16;H05K3/00;(IPC1-7):B32B15/08 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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