| 摘要 |
PROBLEM TO BE SOLVED: To provide lead-free solder essentially consisting of Sn and improved in wettability tough, in the conventional lead-free solder essentially consisting of Sn, wettability has been poor, and soldering defects such as unsoldering, bridges and voids have been generated. SOLUTION: The lead-free solder alloy of this invention is obtained by adding, by mass, 0.005 to 0.2% Ga to Sn which is the main component, or is obtained by adding 0.005 to 0.2% Ga to Sn as the main component. Further, it is also possible that Cu, Sb, Ni, Co, Fe, Mn, Cr, Mo or the like are added for improving the mechanical properties of the above lead-free solders, or Bi, In, Zn or the like are added for lowering the melting point thereof, or P, Ge or the like are added for preventing the oxidation thereof.
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