发明名称 |
Semiconductor testing apparatus including substrate with contact members and conductive polymer interconnect |
摘要 |
A die contacting substrate establishes ohmic contact with the die by means of raised portions on contact members. The raised portions are dimensioned so that a compression force applied to the die against the substrate results in a limited penetration of the contact member into the bondpads. The arrangement may be used for establishing electrical contact and with a burn-in oven and with a discrete die tester. This permits the die to be characterized prior to assembly, so that the die may then be transferred in an unpackaged form. A Z-axis anisotropic conductive interconnect material may be interposed between the die attachment surface and the die.
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申请公布号 |
US6340894(B1) |
申请公布日期 |
2002.01.22 |
申请号 |
US19970947087 |
申请日期 |
1997.10.08 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
FARNWORTH WARREN M.;WOOD ALAN G.;DOAN TRUNG TRI;HEMBREE DAVID R. |
分类号 |
G01R1/04;G01R1/067;G01R1/073;G01R3/00;G01R31/28;H01L21/60;H01L21/66;H01L21/68;H01L23/13;H01L23/498;H05K3/00;H05K3/40;H05K3/42;(IPC1-7):G01R31/02 |
主分类号 |
G01R1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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