发明名称 CONDUCTIVE LAMINATE PACKAGING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a conductive laminate packaging material having excellent antistatic properties, gas barrier properties, not having a dropping problem of impurities with respect to fine particles in the packaging material or having excellent cleanliness without having a contamination problem of ionic impurities such as chlorine ion or the like. SOLUTION: In the conductive laminate packaging material 1 comprising a conductive layer 20 provided on one side surface of a base 10, a gas barrier layer 30 provided on an opposite side surface of the layer 20, and an antistatic sealant layer 50 provided on the surface of the layer 30 via an adhesive layer 40 made of an adhesive or an anchor coating agent, the layer 20 is made of a mixture of a complex forming material of a semipolar boron polymer and an amine compound and a polymer binder, and the layer 50 is made of a heat sealing resin containing the complex forming material of the semipolar polymer and the amine compound.
申请公布号 JP2002019045(A) 申请公布日期 2002.01.22
申请号 JP20000204936 申请日期 2000.07.06
申请人 TOPPAN PRINTING CO LTD 发明人 SHIOKAWA SHUNICHI;WATANABE JIRO;KURODA KENJIRO;KOBAYASHI OSAMU
分类号 B65D65/40;B32B27/18;H01L23/00;(IPC1-7):B32B27/18 主分类号 B65D65/40
代理机构 代理人
主权项
地址