| 摘要 |
An apparatus for identifying a known good die according to an embodiment of the present invention includes a carrier for containing a bare semiconductor chip, a lid for covering the carrier, and a stopper for sealing the apparatus. The carrier includes: a body, in which a chip mount cavity and multiple vacuum suction holes are formed; inner connection terminals formed on a bottom surface of the chip mount cavity to communicate electrically with the bare chip; and outer connection terminals extending from the inner connection terminals to outside the body. The apparatus has an outer configuration of a conventional semiconductor package, so that the apparatus can fit into conventional test equipment. Therefore, the carrier can have a configuration of a plastic package, such as the SOP or SOJ, without a semiconductor chip. Accordingly, the apparatus according to the present invention can use conventional handling and burn-in test equipment in identifying of known good dies and thereby reduce production cost of the known good dies.
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