| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire saw cutter capable of efficiently cutting out a slice semiconductor wafer not having a thickness unevenness and having small warp as compared with a semiconductor crystal ingot, and a method for slicing the ingot. SOLUTION: The wire saw cutter comprises a plurality of bearings, a roller supported to the plurality of bearing having wire engaging grooves on an outer peripheral surface and with a plurality of polymer material coating grooves, and a wire engaged with the outer peripheral surface of the roller with the grooves. The roller with the plurality of polymer material coating grooves is temperature regulated to a predetermined temperature. |
