发明名称 ELECTROPLATED BAND SAW AND MANUFACTURING METHOD FOR IT
摘要 PROBLEM TO BE SOLVED: To provide an electroplated band saw and a manufacturing method for it, having the low side surface resistance in cutting, good linearly moving performance and good sharpness, excellent in cutting precision, and capable of lengthening the life. SOLUTION: This band saw is formed by forming a super abrasive grain layer on an action part by electrodeposition along one side edge of a base metal formed of a flat plate-shaped metallic belt. A method is provided for manufacturing an electro plated band saw formed by providing a back taper on the super abrasive grain layer, and the electro plated band saw formed by providing the taper back along one side edge part of the base metal by machining both side surfaces of the action part and then forming the super abrasive grain layer on it by electrodeposition, or forming the super abrasive grain layer by electrodepositing after previously applying the surface treatment of plating of a back taper shape to the action part along one side edge of the base metal.
申请公布号 JP2002018639(A) 申请公布日期 2002.01.22
申请号 JP20000195541 申请日期 2000.06.29
申请人 ASAHI DIAMOND INDUSTRIAL CO LTD 发明人 MURATA YASUNORI;TAKANO SEIJU
分类号 B23D61/12;B23D61/18;B28D5/04;C25D15/02;(IPC1-7):B23D61/12 主分类号 B23D61/12
代理机构 代理人
主权项
地址