发明名称 Method for applying a protecting lacquer on a wafer
摘要 A method for applying a protective resist, such as a negative resist, to a prepatterned wafer in which the resist is applied to the previously generated patterns by a distribution system which includes a holder for the wafer, an xy sliding unit with a programming device, and a dispensing device with a syringe.
申请公布号 US6340644(B1) 申请公布日期 2002.01.22
申请号 US19990355299 申请日期 1999.09.20
申请人 ROBERT BOSCH GMBH 发明人 BECKER VOLKER;LAERMER FRANZ;SCHILP ANDREA
分类号 H01L21/02;B05D1/02;H01L21/312;(IPC1-7):H01L21/31;H01L21/469 主分类号 H01L21/02
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