发明名称 |
Method of forming circuit patterns on semiconductor wafers using two optical steppers having nonaligned imaging systems |
摘要 |
A method of forming circuit patterns on a semiconductor wafer using two different image steppers having nonaligned optical image systems achieves optical alignment of multiple overlays with high accuracy. A first alignment mark is imaged by the first stepper onto a material layer deposited on the wafer, and a second alignment mark is imaged onto a subsequently deposited material layer using the second stepper. Alignment of the two marks, and thus of successively imaged, overlying circuit patterns, is achieved by translating the optical coordinates of the second alignment system into the those of the first alignment system, and then making corresponding two dimensional adjustment of the wafer position relative to the second stepper.
|
申请公布号 |
US6340547(B1) |
申请公布日期 |
2002.01.22 |
申请号 |
US20000481032 |
申请日期 |
2000.01.11 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD |
发明人 |
CHEN MING-FA;HUNG CHIH-CHIEN;CHEN CHIA-HSIANG;WONG FU-TIEN |
分类号 |
G03F7/20;G03F9/00;(IPC1-7):G03F9/00 |
主分类号 |
G03F7/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|