| 摘要 |
PROBLEM TO BE SOLVED: To improve quality of a printed board by enabling simply setting of an operation parameter of solder printing and enabling changing of the parameter to become an optimum value in response to a change of a printing state. SOLUTION: A printing unit 2 prints to form a solder on the printed board P. An inspecting unit 6 detects the formed solder state. A processing unit 7 outputs control command changing a value of the parameter of the unit 2 in response to the solder state. The unit 6 detects a displacement amount of the solder on the board P by scanning a sensor head, and the unit 7 calculates to obtain a disposing position, height, area, volume and the like of the solder according to the scanning position of the head. The value of the parameter is converged to the optimum value from the solder forming states of a plurality of past number of the boards P and a transition of dealing the command by a history learning means. |
