| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing molding and a polishing surface table using the polishing molding applicable to a machining process and a CMP process for polishing a substrate material for a semiconductor substrate, an oxide monocrystal substrate, various glass substrates, a quartz glass substrate or a ceramic substrate, an optical material requiring precision machining, and the like to attain a polished material surface of high accuracy at much higher speed and to permit stable work without degrading the characteristic even in polishing. SOLUTION: This polishing molding formed of inorganic grains has a sliding- rubbing part and a non-sliding-rubbing part on a face concerned with polishing. Pores existing in the sliding-rubbing part have a diameter of 1 μm or less, and its area is 15-75% of the whole area of the sliding-rubbing part. Further, the area of the non-sliding-rubbing part is 20-80% of the whole area of the face concerned with polishing. The polishing surface table using such a polishing molding is used. |
