发明名称 DEVICE FOR SUCKING PARTS
摘要 PROBLEM TO BE SOLVED: To provide a device for sucking parts with a lower load, capable of applying a higher load thereto during mounting. SOLUTION: The device for sucking parts comprises a nozzle 13 for vacuum sucking the parts W and an operation part 10 driven to be elevated vertically for supporting the nozzle 13 to relatively movable vertically. A load reducing spring 17 for energizing the nozzle 13 upward relative to the operation part 10 and a load applying spring 22 for energizing the nozzle 13 downward relative to the operation part 10 are provided between the operation part 10 and the nozzle 13. The range of operating the energizing force of the load reducing spring 17 on the nozzle 13 is located lower in the range of the nozzle 13 to be movable than the range of operating the energizing force of the load applying spring 22 on the nozzle 13.
申请公布号 JP2002018758(A) 申请公布日期 2002.01.22
申请号 JP20000206572 申请日期 2000.07.07
申请人 MURATA MFG CO LTD 发明人 WAKI AKINORI;MIYATA TOSHIHIKO
分类号 B25J15/06;H05K13/04 主分类号 B25J15/06
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