| 摘要 |
This invention relates to a polishing method for polishing a surface of a material to be polished and a fabrication method of a thin film magnetic head having a planarization process for planarizing the surface of the material to be polished by polishing, and an object thereof is to reduce variations of a residual film thickness on the surface of a material to be polished after polishing. An insulating film 14 is formed on an AlTiC substrate 12 and a bottom shielding layer 16 is formed thereover. After forming a coating layer 18 and etching a mask layer 22 as an etching mask, a protruding portion of the coating layer 18 at the bottom of the opening of the mask layer 22 is removed by a desired thickness. Since a protruding portion of the coating layer 18 on the periphery of the opening of the mask layer is suitably undercut, the protruding portion is shaved, thereby obtaining the coating layer 18 which is planarized as a whole. |
