| 摘要 |
PURPOSE: A method for manufacturing a printed circuit board is provided to make a process simple, increase reliability of products, and enhance a yield. CONSTITUTION: Plasma is used to form a hole(28) on a printed circuit board. A plasma window is formed on a position where the hole(28) is formed. A metal deposition layer which is a plasma resist is formed on other than the portion where the plasma window is formed. A mother material(20) is located within a plasma chamber and the plasma is applied, whereby only the portion corresponding to the plasma window is removed so as to form the hole(28). The hole(28) is presently formed on the printed circuit board, thereby eliminating a separate alining process. When the hole(28) is formed by using the plasma, a physical strength is not applied around the hole(28).
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