Method for finding combination of operation/tool causing integrated failure in semiconductor manufacturing device, involves generating a candidate-operation/tool list

摘要

A method for finding an operations/tools pair for a breakdown or failure in a semiconductor manufacturing device involves generating a candidate operation/tool list, selecting a pair of operations/tools from the candidate list, and establishing a member of the pair of operations/tools as primary operation/tool. A first list of rejects is drawn up, followed by forming a first sum value by sequential summation of the weighting values of each reject in the first rejects list, and a second sum value by sequential summation of the weighting values of each reject in the second rejects list. Each pair of operations/tools is arranged in correspondence with its combination sum peak value and the pair with the greatest combination sum peak values is arranged as that for which the cause of the failure or breakdown is most likely