| 摘要 |
A method of improving the life expectancy of surface mount components is electronic assemblies wherein a distance between the printed circuit board and the surface mount component is held to a predetermined distance defined as the stand-off height. The relationship between the stand-off height and the life expectancy of the component is directly proportional. A larger stand-off height translates into a longer life expectancy. The stand-off height is limited only by manufacturing constraints, such as process limitations and cost concerns. The stand-off height is set to a predetermined dimension by way of a spacer positioned between the surface mount component and the printed circuit board. |
