发明名称 ELECTROLYTIC COPPER-PLATED R-T-B MAGNET AND PLATING METHOD THEREOF
摘要 <p>An R-T-B magnet (R is at least one kind of rare-earth elements including Y, and T is Fe or Fe and Co.) has an electrolytic copper-plating film where the ratio [I(200)/I(111)] of the X-ray diffraction peak intensity I(200) from the (200) plane to the X-ray diffraction peak intensity I(111) from the (111) plane is 0.1-0.45 in the X-ray diffraction by CuKa1 rays. This electrolytic copper-plating film is formed by an electrolytic copper-plating method using an electrolytic copper-plating solution which contains 20-150g/L of copper sulphate and 30-250g/L of chelating agent and contains no agent for reducing copper ions and has a pH adjusted to 10.5-13.5.</p>
申请公布号 WO2002004714(P1) 申请公布日期 2002.01.17
申请号 JP2001005798 申请日期 2001.07.04
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