| 摘要 |
The invention provides methods for making encapsulated organic electronic devices (OED) including organic light emitting diodes (OLED). The present invention can provide a robust OED device by means of in situ edge sealing enhancing structural integrity and device lifetime. The edge sealing is provided by using an adhesive component (14) applied to a substrate (12) prior to OED element (16) deposition. In one OLED embodiment of the present invention, a thin layer of an adhesive (pressure sensitive adhesive, hot melt, or curable) is applied to release liner, openings are cut in the adhesive/liner composite, then the composite is adhered to an electrode-coated substrate. Alternatively, an adhesive may be applied directly onto the electrode-coated substate, e.g., by printing in a desired pattern, optionally partially cured or dried, then covered with one or more liners that act as a mask during deposition of the OLED elements. Another method would be to prepare a blank liner with a patterned adhesive, then die cut openings compplementary to the adhesive pattern in the liner to allow deposition of OLED elements once the adhesive/liner is placed on the substrate. |
