Polishing apparatus

摘要

A polishing apparatus comprises a top ring for holding a workpiece to be polished, and a polishing table movable relatively to the top ring. The polishing table has a polishing surface for polishing the workpiece held by the top ring. The polishing apparatus further comprises a polishing liquid supply device for supplying a polishing liquid to the polishing surface. At least one of the top ring and the polishing table reciprocates linearly in a first direction. The workpiece can be polished uniformly by the polishing surface because at least one of the top ring and the polishing table reciprocates linearly in the first direction.