| 摘要 |
<p>A method of manufacturing a small surface mounting type surface acoustic wave device capable of easily providing a sealability and suitable for a flip chip bonding, comprising the steps of flip chip-bonding a surface acoustic wave device, used as a branching filter for handling a high frequency of approx. several GHz in the field of mobile communication, in the state of the front surface of a piezoelectric substrate facing toward a base substrate, radiating first particulate sealing member from the rear surface upper side of the piezoelectric substrate to adhere the first sealing member onto the rear surface of the piezoelectric substrate, and suspending the first sealing member from the end part of the piezoelectric substrate to the base substrate to form a bridge so as to form a second sealing member on the first sealing member for mounting.</p> |
