A SOLID STATE POWER AMPLIFYING DEVICE

摘要

According to one embodiment, a solid state amplifying device (140) is disclosed. The amplifying device comprises a first input bond pad and a first input connection (325,335) bonded to the first input bond pad. The amplifying device also includes a second input bond pad and a second input connection bonded to the second input bond pad. An equivalent magnitude of current is supplied to the first and second input bond pads (320,330).