ROBOTIC END EFFECTOR FOR SEMICONDUCTOR WAFER PROCESSING
摘要
Disclosed are robotic end effectors (2) used for handling thin media such as semiconductor wafers during processing, including methods and apparatus for replaceably retaining a plurality of standoff pads (6) in the end effectors (2). The end effectors (2) are provided with pad retention areas (4) formed by elastic beams (8).
申请公布号
WO0205326(A2)
申请公布日期
2002.01.17
申请号
WO2001US21710
申请日期
2001.07.10
申请人
INNOVENT, INC.;KRAUSKOFT, NIS;PELLETIER, DOMINIC, G.
