DISSIPATION OF HEAT FROM A CIRCUIT BOARD HAVING BARE SILICON CHIPS MOUNTED THEREON,申请号KR1020017013327-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	DISSIPATION OF HEAT FROM A CIRCUIT BOARD HAVING BARE SILICON CHIPS MOUNTED THEREON
摘要
申请公布号	KR20020005694(A)	申请公布日期	2002.01.17
申请号	KR1020017013327	申请日期	2001.10.19
申请人		发明人
分类号	H01L23/373	主分类号	H01L23/373
代理机构		代理人
主权项
地址

您可能感兴趣的专利

CORED FIBER BOARD AND ITS MANUFACTURE

METHOD AND APPARATUS FOR PREPARING BACTERIAL PEAT FERTILIZER

APPARATUS FOR PREVENTING DERAILING OF CRANE

SAFETY ARRANGEMENT FOR HOIST

IDLER FOR BELT CONVEYER

SELF-UNLOADING PONTOON FOR CARRYING BULK AND LUMP CARGO

EXPANSION JOINT OF MARTS OF MULTILEVEL SHIP OVESTRUCTURE

CONTACTLESS MAGNETIC APPARATUS FOR EVALUATING RUNNING CHARACTERISTICS OF A RAILWAY CAR

TRAIN BRAKE LINE BREAKING ALARM

MAIN BRAKE CYLINDER

FUEL SUPPLY SYSTEM FOR INTERNAL-COMBUSTION ENGINE

APPARATUS FOR CEMENTING VENEER STRIPS INTO CONTINUOUS WEB

APPARATUS FOR STABILIZING THE RATIO OF TENSION OF MOVING MATERIAL IN DIFFERENT AREAS OF A MULTIACTUATOR OF PRODUCTION LINE

DEVICE FOR CONTROLLING REMOTELY LOCATED MANIPULATOR

ARRANGEMENT FOR UNLOADING LOOSE MATERIALS FROM OPEN CAR

STEPPING CONVEYER

APPARATUS FOR BUNDLING REELS