| 摘要 |
<p>The present invention is a method and apparatus for automatically storing and replenishing expandable wafers (140) used in component feeders (130) used automated printed circuit board assembly systems, for example the Hover-Davis Direct Die Feeder (DDF). In the mass production of printed circuit boards automated pick-and-place equipment accepts die from 'chip feeders' and then mounts them at predetermined location on the circuit board. The present invention includes a wafer or tape reel storage bay (116) and a gripping assembly (150) that is moved by a gantry robot to retrieve a wafer or reel (140) from the storage bay (116) and automatically deposit in into a component feeder (130).</p> |
