发明名称 |
ELECTROLESS AUTOCATALYTIC PLATINUM PLATING |
摘要 |
This invention relates to electroless autocatalytic plating of platinum onto a substrate, an aqueous platinum plating bath, a process for plating a uniform coating of platinum onto various substrates using an electroless autocatalytic plating composition, and a platinum plated article formed therefrom. The plating bath of this invention allows direct autocatalytic plating of platinum on catalytically active and inactive, conductive and non-conductive substrates, avoiding the extra costs of activativing a catalytically inactive substrate. |
申请公布号 |
WO0204701(A2) |
申请公布日期 |
2002.01.17 |
申请号 |
WO2001US21221 |
申请日期 |
2001.07.05 |
申请人 |
HONEYWELL INTERNATIONAL INC. |
发明人 |
KOSLOV, ALEXANDER, S.;NARASIMHAN, DAVE;PALANISAMY, THIRUMALAI |
分类号 |
C23C18/44 |
主分类号 |
C23C18/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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