| 摘要 |
The invention concerns a method for cutting a block of material (10) comprising the following steps: a) forming in the block a buried zone (12), embrittled by at least an ion-inserting step, the buried zone delimiting at least a surface part (14) of the block; b) forming at the embrittled zone at least an incipient cleavage (30, 36) using first separating means selected among inserting a tool, injecting a fluid, a heat treatment and/or ion implantation of an ionic species different from that inserted during the preceding step; and c) separating at the embrittled zone of the surface part (14) of the block a remaining part (16), called mass part, from the incipient cleavage (30, 36) using second means, different from the first separation means and selected among heat treatment and/or applying mechanical forces exerted between the surface part and the embrittled zone. The invention is useful for making micro-electronic, optoelectronic or micro-mechanical components, |
