Apparatus and method for chamfering wafer

摘要

A wafer chamfering method comprises the steps of roughly chamfering a periphery of a rotating wafer (W) by a first rotating grindstone (108R) with a large diameter by getting the rotating wafer (W) and the first rotating grindstone (108R) closer to each other; and finely chamfering the periphery of the rotating wafer (W) by a second rotating grindstone (108F) with a small diameter by getting the rotating wafer (W) and the second rotating grindstone (108F) closer to each other.