| 摘要 |
PURPOSE: Flexible printed circuit board, integrated circuit chip mounting flexible printed circuit board, display apparatus incorporating, integrated circuit chip mounted structure, and bonding method of integrated circuit chip mounting flexible printed circuit board are provided to offer an FPC board and an IC chip mounting FPC board with a design to balance a bonding pressure onto each joint part and with excellent bonding reliability. CONSTITUTION: An integrated circuit chip mounting flexible printed circuit board, comprises a mounting region(21) in a substantially quadrangular shape for mounting an integrated circuit chip, and a plurality of inner-leads(13), provided along each side of the mounting region, for being connected with bumps of the integrated circuit chip so that the integrated circuit chip is mounted and bonded in the mounting region, wherein the inner-leads are provided so as to have substantial equality between (a) a sum of areas of superimposing regions for the inner-leads provided on one of facing two sides and the bumps, and (b) a sum of areas of superimposing regions for the inner-leads provided on the other of the facing two sides and said bumps. |
