发明名称 METHOD OF CLEANING POLISHING PAD PREVENTING MICRO SCRATCH
摘要 PURPOSE: A method of cleaning a polishing pad preventing a micro scratch is provided to prevent a micro scratch from particles of slurry formed on a center portion of a polishing pad by injecting uniformly deionized water on the center portion of the polishing pad. CONSTITUTION: A discharge operation of a slurry discharged in a polishing process is stopped(S201). Deionized water is injected from a nozzle to a center portion of a polishing pad(S202). The deionized water is injected uniformly to the surface of the rotating polishing pad and a head assembly. The polishing pad is cleaned by injecting uniformly the deionized water. The number of the nozzle is one or more. A slurry is removed from a surface of the polishing pad by using a rotary force of the polishing pad(S203). The injection operation of the deionized water is stopped from the nozzle(S204).
申请公布号 KR20020004732(A) 申请公布日期 2002.01.16
申请号 KR20000038922 申请日期 2000.07.07
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KANG, GYEONG MUN;LEE, IN GYEONG
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
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