发明名称 |
METHOD OF CLEANING POLISHING PAD PREVENTING MICRO SCRATCH |
摘要 |
PURPOSE: A method of cleaning a polishing pad preventing a micro scratch is provided to prevent a micro scratch from particles of slurry formed on a center portion of a polishing pad by injecting uniformly deionized water on the center portion of the polishing pad. CONSTITUTION: A discharge operation of a slurry discharged in a polishing process is stopped(S201). Deionized water is injected from a nozzle to a center portion of a polishing pad(S202). The deionized water is injected uniformly to the surface of the rotating polishing pad and a head assembly. The polishing pad is cleaned by injecting uniformly the deionized water. The number of the nozzle is one or more. A slurry is removed from a surface of the polishing pad by using a rotary force of the polishing pad(S203). The injection operation of the deionized water is stopped from the nozzle(S204).
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申请公布号 |
KR20020004732(A) |
申请公布日期 |
2002.01.16 |
申请号 |
KR20000038922 |
申请日期 |
2000.07.07 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KANG, GYEONG MUN;LEE, IN GYEONG |
分类号 |
H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
H01L21/304 |
代理机构 |
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