| 发明名称 |
Porous materials |
| 摘要 |
<p>Porous organo polysilica dielectric materials having low dielectric constants useful in electronic component manufacture are disclosed along with methods of preparing the porous organo polysilica dielectric materials. Also disclosed are methods of forming integrated circuits containing such porous organo polysilica dielectric materials.</p> |
| 申请公布号 |
EP1172823(A1) |
申请公布日期 |
2002.01.16 |
| 申请号 |
EP20010302552 |
申请日期 |
2001.03.20 |
| 申请人 |
SHIPLEY COMPANY LLC |
发明人 |
YOU, YUJIAN;LAMOLA, ANGELO A;GORE, ROBERT H.;GALLAGHER, MICHAEL K;ANNAN, NIKOI |
| 分类号 |
C08J9/22;C08J9/26;H01B3/46;H01L21/316;(IPC1-7):H01B3/46;C08J9/02;H01L21/768;H01L21/312;C08L83/04;C08L83/00 |
主分类号 |
C08J9/22 |
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