Low dielectric resin composition

摘要

A low dielectric resin composition comprising the following components (a) and (b), and the dielectric constant of a coating film formed by this composition being at most 3: (a) a resin having functional groups in its molecule and being soluble in a solvent; and (b) a partially hydrolyzed condensate of alkoxysilanes of the formula R<1>mR<2>nSi(OR<3>)4-m-n, wherein each of R<1> and R<2> which may be the same or different, is a non-hydrolyzable group, R<3> is an alkyl group, and m and n are integers of from 0 to 3 satisfying 0