METHOD FOR INSULATING FINE STRUCTURE OF SINGLE CRYSTALLINE SILICON USING TRIPLE LAYER

摘要

PURPOSE: A method for insulating a fine structure of a single crystalline silicon using a triple layer is provided to insulate a fine structure of a single crystalline silicon without an additional photo/etch process. CONSTITUTION: A thermal oxide layer is formed on a fine structure of single crystalline silicon by performing a thermal oxidation process. A conductive layer is insulated electrically with a single crystalline silicon substrate by the thermal oxide layer. A doped polysilicon layer is deposited on a surface of the thermal oxide layer by using an LPCVD(Low Pressure Chemical Vapor Deposition) method. An aluminium layer is deposited on an upper portion of a trench and a part of a sidewall of the trench by using a sputtering method or a deposition method. Each electrode is insulated by etching the deposited polysilicon layer and removing a part of the deposited polysilicon.