| 摘要 |
Heat sinks suitable for use, for example, as semiconductor heat sinks are formed from a unitary precision stamping consisting of at least one rail to which are attached a plurality of heat sink elements. Each of the heat sink elements is attached to the rail by a bridge region of reduced thickness. The heat sinks, supported by the rail member, may be subjected to the anodizing treatment or other surface coating treatment while still attached to the rail. The thickness of the area of reduced thickness is chosen to correspond to the design thickness of the anodized coating. Since the anodized coating penetrates the surface of the part being anodized, by selecting the appropriate thickness for the region of reduced thickness, the anodized coating can be made to fully penetrate the bridge region such that when the heat sink is separated from the rail member, the anodic film completely covers the heat sink, without the presence of bare spots typical of prior art rack-anodized heat sinks.
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