发明名称 Redox system electroless plating method
摘要 To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.
申请公布号 US6338787(B1) 申请公布日期 2002.01.15
申请号 US20000543356 申请日期 2000.04.05
申请人 DAIWA FINE CHEMICALS CO., LTD.;SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 OBATA KEIGO;KIM DONG-HYUN;TAKEUCHI TAKAO;NAKAO SEIICHIRO;INAZAWA SHINJI;KARIYA AYAO;MAJIMA MASATOSHI;NAKAYAMA SHIGEYOSHI
分类号 C23C18/31;C23C18/16;C23C18/34;(IPC1-7):C25C1/00 主分类号 C23C18/31
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