发明名称 COMPOSITION FOR PROTECTIVE FILM
摘要 PROBLEM TO BE SOLVED: To provide a composition for protective film, excellent in heat resistance, adhesion and visible light transmittance, capable of forming a protective film having high surface smoothness even when substrate surface is not flattened and further having extremely high Tg. SOLUTION: This composition for protective film consists essentially of (1) (a) an epoxydized compound of 2-(4-hydroxyphenyl)-2-[4-[1,1-bis(4- hydroxyphenyl)ethyl]phenyl]propane and/or (b) an epoxydized compound of polycondensation product of 2,2-bis(hydroxymethyl)-1-butanol with 1,2-epoxy-4- vinylcyclohexane as an epoxy resin, (2) (c) terpenediphenols and/or (d) 3,3-bis(3-t- butyl-4-hydroxyphenyl)lactic acid ethylene glycol diester as a curing agent and (3) a curing accelerator.
申请公布号 JP2002012819(A) 申请公布日期 2002.01.15
申请号 JP20000195085 申请日期 2000.06.28
申请人 NIPPON KAYAKU CO LTD 发明人 UMEYAMA TOMOE;NIIMOTO HARUKI;HIRANO MASAHIRO
分类号 C09D163/00;C09D133/02;C09D133/04;G09F9/00;G09F9/30;(IPC1-7):C09D163/00 主分类号 C09D163/00
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