Semiconductor device

摘要

A semiconductor device which is provided with enhanced reliability and capable of preventing cracking of a layer below an interconnection layer and separation of the interconnection layer and a bonding pad electrode layer. The semiconductor device includes: an interconnection layer including a conductive material formed on a silicon substrate; an intermediate layer formed in contact with interconnection layer and including a titanium layer and a titanium nitride layer; and a bonding pad electrode layer which is in contact with the intermediate layer.