| 发明名称 |
Lithography method and method for producing a wiring board |
| 摘要 |
The method of producing a wiring board comprises the steps of: preparing a photosensitive resin layer; pressing the photosensitive resin layer; exposing the pressed photosensitive resin layer to light by using a exposure mask on which a predetermined pattern is formed; and developing the exposed photosensitive resin layer.
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| 申请公布号 |
US6338937(B1) |
申请公布日期 |
2002.01.15 |
| 申请号 |
US19990454208 |
申请日期 |
1999.12.09 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
SHIRAI MASAHARU;YAMADA SHINJI |
| 分类号 |
H05K3/06;G03F7/16;G03F7/26;G03F7/38;H05K3/00;H05K3/26;H05K3/46;(IPC1-7):H05K3/06 |
主分类号 |
H05K3/06 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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