| 摘要 |
A ceramic printed circuit substrate includes a glass ceramic substrate and a surface circuit pattern, which is formed on the substrate by use of a conductive paste. The conductive paste contains conductive components of silver and platinum and filler components of molybdenum, tungsten, manganese dioxide, silicon dioxide and copper oxide. A ceramic green sheet and a surface circuit pattern formed thereon by use of the conductive paste are simultaneously fired at a temperature not higher than 1000° C., thereby yielding the ceramic printed circuit substrate.
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