发明名称 |
COOKING UTENSIL PACKAGING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a cooking utensil packaging apparatus whose flap does not easily open after re-packaging, enhanced in transport properties after re- packaging. SOLUTION: A proper amount of a pressure-sensitive hot melt adhesive 6 is applied to the first flaps provided to the front and rear of the upper surface of an outer box, and the second flaps 5 provided to the left and right of the upper surface of the outer box are closed to bond the :first and second flaps 4,5 by the viscosity of the pressure-sensitive hot melt adhesive.
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申请公布号 |
JP2002012287(A) |
申请公布日期 |
2002.01.15 |
申请号 |
JP20000194178 |
申请日期 |
2000.06.28 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
OYA HIROSHI;MIYAZAKI OSAMU;KOYAMA MASAHIRO |
分类号 |
B65D85/68;B65B51/10;B65D77/26;(IPC1-7):B65D85/68 |
主分类号 |
B65D85/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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