发明名称 COOKING UTENSIL PACKAGING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a cooking utensil packaging apparatus whose flap does not easily open after re-packaging, enhanced in transport properties after re- packaging. SOLUTION: A proper amount of a pressure-sensitive hot melt adhesive 6 is applied to the first flaps provided to the front and rear of the upper surface of an outer box, and the second flaps 5 provided to the left and right of the upper surface of the outer box are closed to bond the :first and second flaps 4,5 by the viscosity of the pressure-sensitive hot melt adhesive.
申请公布号 JP2002012287(A) 申请公布日期 2002.01.15
申请号 JP20000194178 申请日期 2000.06.28
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 OYA HIROSHI;MIYAZAKI OSAMU;KOYAMA MASAHIRO
分类号 B65D85/68;B65B51/10;B65D77/26;(IPC1-7):B65D85/68 主分类号 B65D85/68
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