发明名称 INJECTION MOLDING METHOD FOR THERMOSETTING RESIN
摘要 PROBLEM TO BE SOLVED: To solve a problem of no stable execution of the molding of a conforming article due to the narrowing of a connecting passage connecting to molds and the resultant lowering of a vacuumizing pressure by the method wherein residues including gas developed in the mold are evacuated by an evacuating device. SOLUTION: In an injection molding device for filling molten resin in the molds through injection with an injecting device by the opening, closing and clamping of the molds attached to a fixed platen and to a movable platen, in order to remove sludge due to gas developing during the injection and filling of the molten resin and the residues of fins from the molds, the residues including the gas developing in the molds are evacuated with the injecting device in order to blow out the air for discharging the residues from within the connecting passage connected to the molds to the outside of the molds under the state that the molds are opened.
申请公布号 JP2002011766(A) 申请公布日期 2002.01.15
申请号 JP20000194737 申请日期 2000.06.28
申请人 MEIKI CO LTD 发明人 YOSHIDA TOSHIHIRO
分类号 B29C45/34;(IPC1-7):B29C45/34 主分类号 B29C45/34
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