发明名称 SOI CMOS BODY CONTACT THROUGH GATE, SELF-ALIGNED TO SOURCE-DRAIN DIFFUSIONS
摘要 A structure and process for making a semiconductor device with SOI body contacts under the gate conductor. The gate conductor is partitioned into segments and provides a body contact under each gate conductor segment over the width of the device. A plurality of body contacts may be distributed across the length of the gate conductor. This results in a relatively short path for holes leaving the body to traverse and allows accumulated charge to be removed from the body region under the gate. The structure provides for stable and efficient body-contact operation for SOI MOSFETS of any width operating at high speeds.
申请公布号 SG85712(A1) 申请公布日期 2002.01.15
申请号 SG20000003706 申请日期 2000.06.28
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 MICHAEL J. HARGROVE;JACK ALLAN MANDELMAN
分类号 H01L21/28;H01L21/768;H01L23/522;H01L27/12;H01L29/78;H01L29/786;(IPC1-7):H01L21/84 主分类号 H01L21/28
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