发明名称 METHOD OF REINFORCING CUT PART OF CERAMIC SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method of reinforcing a fragile layer of a ceramic substrate caused by cutting and enhancing weathering resistance, especially freezing resistance. SOLUTION: A cut part of the ceramic substrate is reinforced by a sealant containing a polymer having weight-average molecular weight of 8,000-47,000.
申请公布号 JP2002012482(A) 申请公布日期 2002.01.15
申请号 JP20000188320 申请日期 2000.06.22
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 OKAYAMA SEISHI
分类号 C04B41/63;C04B41/48;C09K3/10;(IPC1-7):C04B41/63 主分类号 C04B41/63
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