发明名称 High-permittivity dielectric capacitor for a semiconductor device and method for fabricating the same
摘要 A high-permittivity dielectric capacitor and a fabrication method thereof are provided. The capacitor uses a tantalum oxynitride film as a high-permittivity dielectric film. The tantalum oxynitride film is deposited by chemical vapor deposition using tantalum ethoxide gas as a source of tantalum and oxygen and ammonia gas as a source of nitrogen. The tantalum oxynitride film has a high permittivity, a high thermal stability and a low interface heterogeneity between upper and lower electrodes. Thus, the current leakage due to oxygen vacancy in the film can be reduced.
申请公布号 US6338995(B1) 申请公布日期 2002.01.15
申请号 US19990368210 申请日期 1999.08.04
申请人 JUSUNG ENGINEERING CO., LTD. 发明人 HWANG CHUL JU;KIM KI BUM
分类号 H01L27/108;H01L21/02;H01L21/314;H01L21/8242;H01L27/04;H01L29/94;(IPC1-7):H01L21/824 主分类号 H01L27/108
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