发明名称 |
High-permittivity dielectric capacitor for a semiconductor device and method for fabricating the same |
摘要 |
A high-permittivity dielectric capacitor and a fabrication method thereof are provided. The capacitor uses a tantalum oxynitride film as a high-permittivity dielectric film. The tantalum oxynitride film is deposited by chemical vapor deposition using tantalum ethoxide gas as a source of tantalum and oxygen and ammonia gas as a source of nitrogen. The tantalum oxynitride film has a high permittivity, a high thermal stability and a low interface heterogeneity between upper and lower electrodes. Thus, the current leakage due to oxygen vacancy in the film can be reduced.
|
申请公布号 |
US6338995(B1) |
申请公布日期 |
2002.01.15 |
申请号 |
US19990368210 |
申请日期 |
1999.08.04 |
申请人 |
JUSUNG ENGINEERING CO., LTD. |
发明人 |
HWANG CHUL JU;KIM KI BUM |
分类号 |
H01L27/108;H01L21/02;H01L21/314;H01L21/8242;H01L27/04;H01L29/94;(IPC1-7):H01L21/824 |
主分类号 |
H01L27/108 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|