发明名称 |
Compliant leads for area array surface mounted components |
摘要 |
An area array integrated circuit package having contact pads is provided with compliant rectangular shaped connection leads each attached to a contact pad. The leads are arranged and oriented on the surface of the package around the neutral point of the package such that the flat width dimension of each lead faces the neutral point of the contact array, thereby offering optimal compliance against thermally induced deformation and resulting in improved interconnection reliability.
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申请公布号 |
US6339534(B1) |
申请公布日期 |
2002.01.15 |
申请号 |
US19990434269 |
申请日期 |
1999.11.05 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
COICO PATRICK A.;GUERIN LUC |
分类号 |
H01L23/498;H05K3/34;H05K13/04;(IPC1-7):H05K7/02 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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