| 摘要 |
PROBLEM TO BE SOLVED: To provide an acrylic thermoset adhesive excellent in adhesive strength to a polyimide film, having heat resistance bearing the heat of the solder reflow at the time of mounting, and hardly causing abnormal appearance caused by flowing-out or the like of the resin at the time of adhesion, and further to provide adhesive sheets having adhesive layers formed out of the adhesive. SOLUTION: This acrylic thermoset adhesive composition comprises an acrylic polymer obtained by copolymerizing a monomer mixture comprising (A) an imide group-containing (meth)acrylate, (B) an alkyl (meth)acrylate, and (C) a functional group-containing monomer having reactivity with an epoxy group, and an epoxy resin.
|
