发明名称 ELECTROLESS CONVERSION GOLD-PLATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electroless conversion gold-plating method which can form a uniformly gold-plated film at a constant deposition rate for a long term and greatly prolong the renewal time of a gold-plating solution. SOLUTION: The electroless conversion gold-plating method for plating gold on an article to be plated, which is dipped in the gold-plating solution including gold cyanide salt, is characterized by plating while controlling a content of free cyanide ion included in the gold-plating solution to a fixed quantity or less.
申请公布号 JP2002012979(A) 申请公布日期 2002.01.15
申请号 JP20010039716 申请日期 2001.02.16
申请人 OKUNO CHEM IND CO LTD 发明人 UESUGI MASAMI;MURATA TOSHIYA;TAKEUCHI SATOKO;OTSUKA KUNIAKI
分类号 C23C18/42;H05K3/18;(IPC1-7):C23C18/42 主分类号 C23C18/42
代理机构 代理人
主权项
地址