发明名称 |
ELECTROLESS CONVERSION GOLD-PLATING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide an electroless conversion gold-plating method which can form a uniformly gold-plated film at a constant deposition rate for a long term and greatly prolong the renewal time of a gold-plating solution. SOLUTION: The electroless conversion gold-plating method for plating gold on an article to be plated, which is dipped in the gold-plating solution including gold cyanide salt, is characterized by plating while controlling a content of free cyanide ion included in the gold-plating solution to a fixed quantity or less.
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申请公布号 |
JP2002012979(A) |
申请公布日期 |
2002.01.15 |
申请号 |
JP20010039716 |
申请日期 |
2001.02.16 |
申请人 |
OKUNO CHEM IND CO LTD |
发明人 |
UESUGI MASAMI;MURATA TOSHIYA;TAKEUCHI SATOKO;OTSUKA KUNIAKI |
分类号 |
C23C18/42;H05K3/18;(IPC1-7):C23C18/42 |
主分类号 |
C23C18/42 |
代理机构 |
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