| 摘要 |
On a liquid crystal display device (80) comprising a first substrate (81) and a second substrate (82) with electrodes (83, 84), formed thereon, respectively, and liquid crystal (85) sealed thereinbetween, a semiconductor device (1) for driving the liquid crystal display device (80) is mounted. The semiconductor device (1) is provided with a plurality of bumps (24), each electrically conductive with respective electrode pads provided on the upper surface of a semiconductor chip (12) with an integrated circuit formed thereon, through the intermediary of respective lower electrodes, provided so as to stretch over the upper surface and two sidewall faces of the semiconductor chip (12), respectively. The semiconductor device (1) is mounted on the surface of a part of the first substrate (81) of the liquid crystal display device (80) where the first substrate (81) is extended beyond an edge of the second substrate (82) such that one of the sidewall faces of the semiconductor chip (12) is opposite thereto, thereby connecting the bumps (24) to the electrodes (83) formed on the first substrate (81), respectively. The other of the sidewall faces of the semiconductor chip (12) is connected with an end portion of an FPC (60). As a result, an area of junctions can be lessened, thereby achieving downsizing of the liquid crystal display device.
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