| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing an optical semiconductor, excellent in transparency and soldering resistance, and an optical semiconductor device sealed with its cured material. SOLUTION: The epoxy resin composition comprises essentially an epoxy resin (A), a curing agent (B) containing at least one of a phenolic novolak and a compound which has at least two phenolic hydroxyl groups in the molecule and wherein the substituent for the phenol nucleus has no α-hydrogen atom, a filler (C), a cure accelerator (D), a phosphorus antioxidant (E), and a hindered phenol antioxidant (F), wherein the filler C comprises glass particles consisting mainly of SiO2, CaO, B2O3 and Al2O3, the difference between the refractive index of the cured material of resinous components other than the component C and the refractive index of the component C is at most 0.01, and the filler C accounts for 5-70 wt.% of the total epoxy resin composition. The optical semiconductor device is sealed with a cured material of the composition. |
