RESIN COMPOSITION, LAMINATED BOARD AND WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a resin composition, and a laminated board and a wiring board using the same, the composition having flame retardency without using a halogenized compound, and an excellent adhesive strength to a circuit conductor and an insulating property when it is left under a high temperature and high humidity atmosphere, and having a good resolvability in a photolithography. SOLUTION: The resin composition to be used comprises containing a polyphosphoric acid melamine in a resin which is cured by means of light or heat.